April 18th, 2007

IntelIn the first half of next year, Santa Rosa platform will be refreshed with the 45nm Hi-k Intel dual core mobile processor, code-named “Penryn”. Later in 2008 Intel will deliver “Montevina” processor technology, the successor of Santa Rosa, also with the 45nm Hi-k Intel dual core mobile processor, the Corporation’s representatives unveiled today at Intel Developer Forum in Beijing.

With approximately 40 percent smaller components, Montevina will be ideal for mini- and sub-notebooks, and will include integrated hardware decode for high-definition video, according to Intel’s representatives.

“Montevina” will be Intel’s first Centrino processor technology for notebooks to offer the option of integrated Wi-Fi and WiMAX wireless technologies. The slides from IDF also show this platform will have new “Cantiga” chipset, as well as “Robson 2.0” – the next version of disc-caching technology for faster system boot-up and application loading.

Regarding UMPC and MID devices, Intel will pull in its next-generation ultra-mobile platform – codenamed “Menlow” – from late 2008 to the first half of 2008.

“Menlow will include a new processor, codenamed “Silverthorne”, based on a new 45nm Hi-k low power microarchitecture. The platform also includes the next-generation chipset, codenamed “Poulsbo,” providing a single-chip solution. Silverthorne and Poulsbo were both designed from the ground up for MID and UMPC platforms,” Corporation announced.

Intel

In Laptop News, Laptop CPU, Notebook Platforms
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[…] DailyTech also reports that Intel’s next mobile platform, codenamed “Montevina”, will not arrive until Q2’2008. […]

July 18th, 2007 at 1:10 pm |

[…] According to the earlier reports, the processors will be designed for use in the Intel’s “Santa Rosa Refresh” laptop platform, also scheduled for release in January next year. In the first half of 2008, the company is expected to release other 45nm laptop CPUs, which will be used in next-generation Intel “Montevina” platform. […]

December 5th, 2007 at 9:13 pm |

[…] Intel also confirmed “Menlow” platform shipments in the first half of 2008. This platform is designed for use in Mobile Internet Devices (MIDs) and Ultra Mobile PCs (UMPCs). […]

December 16th, 2007 at 1:30 pm |

[…] “The tiniest in the industry, the Intel Z-P140 PATA SSD is designed for ultra-small mobile internet devices, digital entertainment and embedded applications and is part of the proposed Intel “Menlow” platform. The Intel Z-P140 PATA SSD comes in 2 Gigabyte (GB) and 4GB densities, extendable to 16GB,” the chip maker says. […]

December 17th, 2007 at 4:09 pm |

[…] The next-generation Intel “Menlow” platform for UMPC and MID devices includes a new processor codenamed “Silverthorne”, produced using 45-nanometer technology, and the “Poulsbo” chipset, providing a single-chip solution. The “Menlow” is scheduled for release in the first half of 2008. […]

January 5th, 2008 at 8:45 pm |

[…] The “Montevina” platform will be launched in May this year, according to DigiTimes. Intel revealed that the launch of the platform is currently scheduled for the first half of 2008. […]

January 15th, 2008 at 4:13 pm |

[…] The upcoming Intel Centrino 2 “Montevina” platform will use the new 45-nanometer “Penryn” processors and has a 1066MHz front side bus, which is up from current 800MHz. […]

February 18th, 2008 at 4:13 pm |

[…] Intel’s next-generation Centrino 2 notebook platform, codenamed “Montevina” will be available with both high performance and mainstream integrated graphics processors, incorporated into the GM47 and GM45 chipsets respectively, VR-Zone reports. […]

February 27th, 2008 at 3:47 pm |

[…] Intel is planning to launch the High Performance SSD solid state drive products by the end of the third quarter this year. The chip maker will bundle the SSDs as a part of its upcoming Centrino 2 “Montevina” laptop platform, DigiTimes’ sources at PC makers say. […]

May 26th, 2008 at 10:06 am |

[…] Previously, Intel was expected to release “Montevina” at the 2008 Computex show in Taipei, June 3-7. Along with the new CPUs, chipsets, and wireless modules, the next-gen platform includes updated integrated graphics, support for faster front side bus and system memory, new version of the Intel Turbo Memory, and presumably the High Performance SSD. […]

May 28th, 2008 at 6:32 pm |
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